Taken to the extreme, today’s high-end graphics processors (GPUs) can execute thousands of simultaneous operations, which is fundamental for highly parallel 3D visualizations and complex AI [artificial intelligence] processing tasks.

New and efficient approaches to cabinet and console design, fabrication, integration, and qualification are enabling prime defense contractors to quickly equip the U.S. Navy with better electronics technology and enclosures while increasing return on investment.

Power, reliability and real-time computing capabilities are just some of the advantages of using multicore processors.

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

New technologies such as virtualisation, sensor improvements and data fusion are enhancing the effect of CMS on modern fleets, allowing greater range and faster transfer of critical information.

Industry standards and guidelines such as MOSA, SOSA, CMOSS, SAVE, and FACE are driving the latest developments in enclosures, chassis, and backplane databuses, as small for factors are ready to take center stage.

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.