New and efficient approaches to cabinet and console design, fabrication, integration, and qualification are enabling prime defense contractors to quickly equip the U.S. Navy with better electronics technology and enclosures while increasing return on investment.

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

New technologies such as virtualisation, sensor improvements and data fusion are enhancing the effect of CMS on modern fleets, allowing greater range and faster transfer of critical information.

Industry standards and guidelines such as MOSA, SOSA, CMOSS, SAVE, and FACE are driving the latest developments in enclosures, chassis, and backplane databuses, as small for factors are ready to take center stage.

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.

Ivan Straznicky talks about the challenges of keeping rugged computer systems designed for military programs cool under harsh conditions as they grow more powerful and more complex.

With faster processors, more functions, and higher bandwidth than ever before, today’s avionics are pushing the cooling technology envelope to the breaking point – and beyond.