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2023 Military & Aerospace Technology Innovators Awards Announced

2023 Military & Aerospace Technology Innovators Awards Announced

The PacStar Secure Mesh Command Post (SMCP) is a secure vehicle-to-vehicle tactical communications solution for expeditionary environments, and meets U.S. military demand for secure warfighter mobility.

01/03/2024
Military Embedded Systems Magazine

Design Challenges for Naval Equipment Enclosures

New and efficient approaches to cabinet and console design, fabrication, integration, and qualification are enabling prime defense contractors to quickly equip the U.S. Navy with better electronics technology and enclosures while increasing return on investment.

09/08/2023
Secure Mesh Wireless Networks Drive Command Post Mobility

Secure Mesh Wireless Networks Drive Command Post Mobility

For years, the goal of our armed forces has been mobility at the command post, with Army leaders setting the standard to be able to move hourly, with the command post’s network ready, powered up and receiving in five minutes.

11/30/2022
Military & Aerospace Electronics

Thermal-Management Techniques Take-on the Heat

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

10/27/2022
Shephard

Sensing Trouble: How CMS are Lifting the Fog of War

New technologies such as virtualisation, sensor improvements and data fusion are enhancing the effect of CMS on modern fleets, allowing greater range and faster transfer of critical information.

07/04/2022
military and aerospace electronics

Embedded Computing Enclosures go Standard, and go Small

Industry standards and guidelines such as MOSA, SOSA, CMOSS, SAVE, and FACE are driving the latest developments in enclosures, chassis, and backplane databuses, as small for factors are ready to take center stage.

02/24/2022
Military & Aerospace Electronics

Is Thermal Management up to the High-performance Computing Challenge?

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

10/29/2021
Military & Aerospace Electronics

The Evolution of Embedded Computing Chassis, Backplanes, and Enclosures

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.

02/25/2021