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Defense Solutions Product Guide

Defense Solutions Product Guide

Explore Curtiss-Wright's mission-critical solutions based on the latest technologies and open standards. These innovative solutions are trusted and proven for aerospace and defense applications.

02/22/2024
ground vehicle header image

Ground Vehicle Mission Management Systems

Mission management systems that meet ever-present size, weight, and power (SWaP) demands while providing the scalability and flexibility to handle all of the mission tasks today’s warfighter may encounter.

10/26/2023
The Open Group Sensor Open Systems Architecture (SOSA) and CMOSS Brochure

The Open Group Sensor Open Systems Architecture and CMOSS Brochure

Technical standards like SOSA and CMOSS alleviate interoperability, sustainability, and SWaP challenges by efficiently reusing proven technology.

05/26/2022
COTS Boards Brochure

COTS Boards Brochure

COTS products and open-architecture solutions for mission computing, signal processing, graphics, communication fabrics, system and sensing I/O, and data storage.

05/16/2022
Modified COTS Brochure

Modified COTS Brochure

Gain a competitive edge with Modified COTS solutions that address all your development requirements – from the design and manufacture of custom cards, BSP packages and drivers, and providing rapid subsystem pre-integration capabilities.

03/26/2022
vetronics solutions

Vetronics Solutions Brochure

03/01/2022
Canada regional capabilities

Curtiss-Wright Canada Regional Capabilities Brochure

For Canadian programs, Curtiss-Wright’s ability to design, develop, and manufacture technology on Canadian soil supports the Government of Canada’s Industrial Technological Benefits and Value Proposition (ITB/VP) Program.

12/01/2021
US Regional Capabilities Brochure

Curtiss-Wright U.S. Regional Capabilities Brochure

With design and manufacturing centers of excellence in seven states, and engineers, sales and support teams across the U.S., Curtiss-Wright Defense Solutions is uniquely positioned to address the most challenging electronics, packaging, and systems challenges.

11/21/2021