Taken to the extreme, today’s high-end graphics processors (GPUs) can execute thousands of simultaneous operations, which is fundamental for highly parallel 3D visualizations and complex AI [artificial intelligence] processing tasks.

Much of the innovation in high-performance embedded computing starts with microprocessors.

New and efficient approaches to cabinet and console design, fabrication, integration, and qualification are enabling prime defense contractors to quickly equip the U.S. Navy with better electronics technology and enclosures while increasing return on investment.

For many COTS [commercial off-the-shelf] vendors and VITA members, the Tri-Service Memo issued in January 2019 by the secretaries of the Army, Navy, and Air Force was the highest validation of several decades of their combined efforts.

For defense applications, responsiveness, accuracy, and precision have never been more critical to mission success.

For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.

The partnership between Curtiss-Wright and BAE Systems to develop a standardized MOSA open architecture for next-generation ground vehicles shows how MOSA can be leveraged to deliver new capabilities to next-generation ground vehicles.

Now that the Army has chosen its preferred Future Long Range Assault Aircraft in Bell’s V-280 advanced tiltrotor, the race is on to populate it with mission systems that will allow the machine to operate through adversaries’ sophisticated air defense systems.