New V3-717 3U OpenVPX graphics processor module supports DO-254 DAL A and FACE-aligned software drivers with well-sourced, long proven AMD Radeon E8860 GPU.

New PacStar TFS system, based on Intel® processors and NVIDIA® GPUs, combines high-performance processing and secure network connectivity to support tactical and expeditionary sensor fusion applications.

Today, increasing demand for functionality in modern aircraft is driving a critical need for virtualized avionics systems that combine separate capabilities into a single ruggedized and compact computer.

Curtiss-Wright signs Italy’s leading embedded electronics distributor to represent its industry-leading range of COTS module and system solutions.

Modular open system approach OpenVPX processing modules to be used in Next Generation Special Mission Processor (NextGen SMP) program for AC/MC-130J aircraft.

Parvus DuraCOR 313 mission computer combines next-gen Intel processing with support for Time-Sensitive Networking (TSN) in modular small form factor rugged design

In August 2021, Intel announced the new Intel Xeon W-11000E Series processor ­(formerly known as “Tiger Lake-H”), designed for the embedded market.

Parvus DuraCOR AGX-Xavier delivers high-performance NVIDIA GPU-accelerated processing and deep learning engines in ultra-rugged SFF mission computers designed for extreme aerospace and defense applications.